- dual in line package integrated circuit
- n інтегральна схема в корпусі з подвійним рядом
English-Ukrainian military dictionary. 2015.
English-Ukrainian military dictionary. 2015.
Dual in-line package — PDIP redirects here. PDIP may also refer to Indonesian Democratic Party – Struggle. Three 14 pin (DIP14) plastic dual in line packages containing IC chips … Wikipedia
dual in-line package — Abbreviated DIP. A standard housing constructed of hard plastic commonly used to hold an integrated circuit. The circuit s leads are connected to two parallel rows of pins designed to fit snugly into a socket; these pins may also be soldered… … Dictionary of networking
dual in-line package — noun Electronics a package for an integrated circuit consisting of a sealed unit with two parallel rows of downward pointing pins … English new terms dictionary
Ceramic Dual In-line Package — Dual Inline Package Pour les articles homonymes, voir DIP. Boîtier DIL à 16 broches … Wikipédia en Français
Plastic Dual In-line Package — Dual Inline Package Pour les articles homonymes, voir DIP. Boîtier DIL à 16 broches … Wikipédia en Français
Shrink Plastic Dual In-line Package — Dual Inline Package Pour les articles homonymes, voir DIP. Boîtier DIL à 16 broches … Wikipédia en Français
Integrated circuit — Silicon chip redirects here. For the electronics magazine, see Silicon Chip. Integrated circuit from an EPROM memory microchip showing the memory blocks, the supporting circuitry and the fine silver wires which connect the integrated circuit die… … Wikipedia
Integrated circuit packaging — Early USSR made integrated circuit Integrated circuit packaging is the final stage of semiconductor device fabrication per se, followed by IC testing.Packaging in ceramic or plastic prevents physical damage and corrosion and supports the… … Wikipedia
Integrated Circuit — Integrierter Schaltkreis. Das Chip Gehäuse wurde geöffnet und ermöglicht den Blick auf den eigentlichen Halbleiter. Die erkennbaren Strukturen im Zentrum sind die realisierte elektronische Schaltung. Im Außenbereich sind die goldenen… … Deutsch Wikipedia
Zig-zag in-line package — The zig zag in line package or ZIP was a short lived packaging technology for integrated circuits, particularly dynamic RAM chips. It was intended as a replacement for dual in line packaging (DIL or DIP). A ZIP is an integrated circuit… … Wikipedia
Printed circuit board — Part of a 1983 Sinclair ZX Spectrum computer board; a populated PCB, showing the conductive traces, vias (the through hole paths to the other surface), and some mounted electrical components A printed circuit board, or PCB, is used to… … Wikipedia